Typical Photo Etching Products Solution Analysis
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Part Name |
Quality Requirements |
Solution Analysis |
Why Choose Etching Solution |
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✳No block hole, no burrs, no deformation. ✳Material stainless steel thickness=0.1mm. ✳Hole diameter=0.15mm, center to center distance=0.3mm. ✳Tolerance +/-0.02. |
✳Solution A: Laser cutting, need to open the holes one by one, very slow, low efficiency and cost very high. ✳Solution B: Stamping process, need to open tooling dies, can’t open the hole=0.15mm, would have burrs. ✳Solution C: Etching process |
✳ No tooling cost. ✳ Burr and stress free, metal properties and planeness unaffected. ✳ Wide range of material, can process over 2000 types of metal material including hard to machine metals. ✳ Accuracy +/-0.01mm achievable when material thickness is below 0.1mm. ✳ Lead time in 3-5 days. ✳ No limit to pattern complexity or aperture array ✳ Scalable batch production. |
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Full Opened Microporous Mesh/Filter |
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Etching Solution Steps |
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1. Lamination |
2. Developing |
3. Etching |
4. Stripping |
What Is Photo Chemical Etching?
Etching, also known as Photo Chemical Etching (PCM), It is a technology that removes materials using chemical reactions, by exposure and development processes the pattern of the product are transferred onto the metal sheet or substrate plate, and then the product area would be protected by etchant resist, while the unwanted area the etchant resist would be removed and leave the metal sheet or substrate plate uncovered, when the chemical solution meet the metal sheet or substrate corrosion take happen, forming a concave-convex, half-engraved or through cut shape effect. At first etching is used on printing embossing plate and PCB manufacturing industries, after a long time improvement and development of etching equipment and technology, now it has been widely used in aviation, machinery, chemistry, medical industries, especially in the fields of semiconductor manufacturing, chip processing, and ultra-thin electronic sheet parts, precision etching is an indispensable technology.
Etching can be divided into two types: wet etching and dry etching.
Dry etching:
Drawing Engineering → Material Preparation and Cutting → Material Cleaning → Drying → Etchant Resist Coating → Exposure → Development → Baking → Spot Filling → Etching → Stripping → Product.
Wet etching:
Cutting → Material Cleaning → Silk Printing → Etching → Stripping → Product.
Photo Chemical Ething Machine Line
More Typical Photo Chemical Etching Solutions
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