Heat Dissipation Plate also known as vacuum chamber vapor chamber, is divided into upper sheet and lower sheet, which is similar to heat pipe technology in principle, but differs in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum chamber vapor chamber is conducted on a two-dimensional surface, so the efficiency is higher. Specifically, after absorbing the heat of the chip, the liquid at the bottom of the vacuum chamber evaporates and diffuses into the vacuum chamber, conducts the heat to the heat dissipation fins, and then condenses back to the bottom as a liquid. This kind of evaporation and condensation process similar to the refrigerator air conditioner circulates rapidly in the vacuum chamber to achieve a relatively high heat dissipation efficiency. Copper and its alloys have good thermal conductivity and are ideal materials for heat sinks.