DCB(Direct Bonding Copper) is composed of ceramic substrate, bonding layer and conductive layer. It refers to a special process method in which copper foil is directly bonded to the surface of alumina or aluminum nitride ceramic substrate at high temperature. Thermal conductivity, high adhesion strength, excellent solderability and excellent electrical insulation properties are the basic materials for high-power power electronic circuit interconnection technology and structural technology, and its function is similar to integrated circuit lead frame.

Because of the advantages of strong mechanical stress, stable shape, high strength, high insulation, high thermal conductivity, anti-corrosion and strong bonding force, ceramic CCL is widely used in:

1. Automotive electronics, aerospace and military electronic components.

2. Intelligent power components, solid state relays, high frequency switching power supplies.

3. Solar panel components, special telecommunications switches, receiving systems, lasers and other industrial electronics.

4. High-power power semiconductor modules, electronic heaters, semiconductor refrigerators, power control circuits, and power hybrid circuits.