IC (integrated circuit) lead frame is the chip carrier of the integrated circuit. It is a kind of connection material (gold wire, aluminum wire, copper wire) that realizes the electrical connection between the terminal of the internal circuit of the chip and the external lead to realize the terminal of the internal circuit of the chip and the external lead. Electrical connection is a key structural component that forms an electrical circuit. It acts as a bridge to connect with external wires. Most semiconductor integrated blocks need to use lead frames. The lead frame acts as a fixed chip in the integrated circuit and protects the internal components. It is the key component of integrated circuits and an important basic material in the electronic information industry, which is widely used in LED displays, circuit boards, signals, visible and invisible light source product components.

With the development of integrated circuits towards high density, miniaturization and multi-function, the requirements for lead frames and electronic packaging materials are also getting higher and higher. Commonly used materials are: KFC, 194, 7025, FeNi42, TAMAC-15, PMC-90, etc., which are mainly selected according to the performance required by the product (strength, electrical conductivity and thermal conductivity). The product types are TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT, etc. Lead frame is the most important one of the three major raw materials for packaging (lead frame, gold wire, and packaging glue). Lead frames can be divided into single lead frames and integrated circuit lead frames according to their functions. The single lead frame also contains supporting transistors, diodes and light-emitting diodes and other products; the integrated circuit lead frame is used for semiconductor packaging. , as a medium for connecting chips and printed circuit boards, different integrated circuits use different packaging methods, and the lead frames used are also different.